Innovation meets precision for research and development

Research & development applications

The Incus technology offers additive manufacturing at the highest resolution with the ability to use the parts without comprehensive post-processing, producing a functional component directly after the sintering step. These aspects set Incus apart from other metal AM providers and enables easy production of sophisticated R&D equipment within days and fast design iterations.

Application story: Stamp & die for UpNano

Incus development partner, UpNano is a Vienna-based high-tech company with focus on development, manufacturing and commercialization of high-resolution 3D-printing systems based on two-photon polymerization.  UpNano uses a stamp and die in their test methods designed to be multi-functional and integrate four three-point-bending test arrangements into one setup, making this method the “Swiss army knife of 3-point bending”. The Incus metal 3D-printing approach was the ideal production technology for UpNano, as it enables the quick redesign and production of the parts needed for the test setup.


Read more about this project here.

“Due to the great lithography network of Vienna University of Technology, 
it was evident that this test setup would be realized with the innovative technology from Incus.”
Denise Hirner, Founder & Head of Marketing & Business Development, UpNano
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